multichip packaging
英 [ˌmʌltɪˈtʃɪp ˈpækɪdʒɪŋ]
美 [ˌmʌltiˈtʃɪp ˈpækɪdʒɪŋ]
网络 多芯片封装
双语例句
- COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。 - 3-D Multichip Module ( MCM) is the developing trend of microelectronic packaging in the future.
3-D多芯片组件（MCM）是未来微电子封装的发展趋势。